SiPaaS Solutions
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Packaging and Testing

VeriSilicon's flexible engagement model provides seamless interface to assembly, substrate and test partners. Our breadth of services includes:

  • Package: substrate, tooling
  • Test plan generation, wafer sort and final test program development, debug and release to production, test pattern conversion, probe card and load board design
  • WIP (work in process) monitor and drop ship
  • Yield analysis and trouble shooting
  • Failure analysis
  • Product qualification and production release
  • RMA (returned material analysis) negotiation and compensation