SiPaaS Solutions
Package Service

VeriSilicon's one-stop package solution enables real time chip-package-board design fine tuning and fast process problem solving. Our expertise in design, simulation and engineering ensures quick and gapless co-design with high efficiency package development and production management. Our main services include the following:

  • PACKAGE ENGINEERING SERVICES
  • BOM selection and process flow definition
  • Quick prototyping support
  • Package development monitoring and trouble shooting
  • Assembly yield monitoring and subcontractor management
  • PACKAGE DESIGN SERVICES 
  • Package selection consultant
  • Customized package design with multiple format support
  • Customized package characterization covering Chip-Package-Board co-design and co-simulation
 
Example of VeriSilicon Package Service